FCCL - PI Copper Clad Laminate

This series includes various types according to different copper and PI film utilized to meet the specific needs of customers. 

This series includes various types according to different copper and PI film utilized to meet the specific needs of customers. See usual specifications as follows:

Base PI film: 0.5 ~ 2.0mils thickness;
Copper foil: EDHD & RA copper both available1/31/21.0 & 2.0 Oz thicknesses;
Adhesive: Modified epoxy adhesive0.5 ~ 0.7 mils;
Laminate structure: Single side & Double sides both available;

Features & Applications:
--Meet the RoHS requirement & halogen freeand pass SGS certificate.
--Higher bond strengthgood dielectric properties
--Excellent chemical and solvent resistancegood solder heating resistance.
--Excellent dimensional stability.

Widely used in the data communication, aerospacepersonal computer and automotive fields.