Specifications
1. Resin-plugging PCB
2. Impedance:5 single-ended 50ohm,differential 100ohm
• General Manufacturing Capability
| Category | Description | Capability |
| File Formats | Gerber files- preferred | 274-X,274-D,DPF,ODB++ |
| Drill file | X & Y coordinates, with tool sizes included | |
| Size | Max. finished dimensions | 580mm x 800mm ¨C Single/ Double-sided |
| 550mm x 800mm ¨C Multilayer | ||
| Board Thickness | Standard | 1.6mm ¡À10% |
| Min. | Single/ Double-sided:0.2mm ¡À0.1mm | |
| 4-layer:0.4mm ¡À0.1mm | ||
| 6-layer:0.6mm ¡À0.1mm | ||
| 8-Layer:1.0mm ¡À0.1mm | ||
| 10-layer:1.0mm ¡À0.12mm | ||
| 12-layer:1.2mm ¡À0.12mm | ||
| ¡ | ||
| 32-layer:4.0mm ¡À0.4mm and above | ||
| Max. | 6.3mm ¡À10% | |
| Bow and twist | < 7/1000 | |
| Copper | Outer Cu weight | 1oz ~ 10oz |
| Weight | Inner Cu wight | 1/3oz ~ 6oz |
| Laminate Materials | FR4(High TG,halogen-free),FR5,ISOLA(FR408,370HR),TEFLON,POLYIMIDE,ROGERS(RO4003,RO4350,RO4450),Aluminum plate (Single,Double-sided) | |
| FR4 Thickness | 1.6mm | |
| High TG FR4 (170 deg C) | 1.6mm | |
| Board Cutting | Max. number of layers | 32 |
| Min. thickness for inner layers (Cu thickness are excluded) | 0.07mm | |
| Drilling | Min. size | 0.1mm |
| Max. size | 6.0mm | |
| Drill Deviation | ¡À0.002¡± (0.050mm) | |
| PTH hole tolerance | ¡À0.003¡± (0.075mm) | |
| NPTH hole tolerance | ¡À0.002¡± (0.050mm) | |
| Angle of Countersink | 80¡ã,90¡ã,100¡ã,120¡ã | |
| Plating | Min. hole size | 0.0008¡± |
| Aspect ratio | 20 | |
| Etching | Trace width tolerance | ¡À20% |
| Min. trace width / space (1oz finished Cu weight starting from 1/3oz) | 0.003¡±/ 0.003¡±(0.08mm) | |
| Min. trace width / space (1oz finished Cu weight starting from 1/2oz) | 0.004¡±/ 0.004¡±(0.1mm) | |
| Min. trace width / space (2oz finished Cu weight) | 0.005¡±/ 0.005¡±(0.127mm) | |
| Min. trace width / space (3oz finished Cu weight) | 0.008¡±/ 0.008¡±(0.2mm) | |
| Min. trace width / space (4oz finished Cu weight) | 0.012¡±/ 0.012¡± (0.3mm) | |
| Inner Layers | Min. space from drilling to inner pattern | 0.1mm |
| Min. space from annular ring to inner pattern | 0.1mm | |
| Layer-to-layer registration | ¡À0.003¡±(0.08mm) | |
| Solder Mask | Color | green,light green,matte green,white,extreme white,black,matte black,dark brown,yellow,red,blue,transparent |
| Min. solder mask clearance | 0.003¡± | |
| Thickness | 0.0004¡± | |
| Silkscreen | Color | White,black,yellow,red,blue,green |
| Min. trace width | 0.005¡± | |
| Min. size | 0.028¡± / 0.028¡± | |
| Electrical Test | AOI | Y |
| Flying Probe Tester | Y | |
| Controlled Impedance | Tolerance | ¡À10% |
| Impedance tester | Tektronix TDS8200 | |
| Routing | End Mills Test | ¡À0.15mm(0.006¡±) |
| CNC Tolerance | ¡À0.15mm(0.006¡±) | |
| V-Cut Depth | ¡À0.1mm(0.004¡±) | |
| V-cut angle deviation | ¡À0.1mm(0.004¡±) | |
| Semi-hole | Y | |
| Surface Finish | HASL,HASL pb free,immersion gold,immersion silver,immersion tin,O.S.P (Entek),S/G plating,ENEPIG,G/F plating,carbon¡ | |
| Blind and Buried Vias | 3+N+3 | Y |
| Resin,hole-filling ink,PTH | Y | |
| Others | UL Cert. | Y |
| ISO Cert. | ISO9001/ISO14001/RoHS | |