Specifications
1.Free Test& Free programmer
2.customs circuit board
3.pcb design & manufacture
FR-4 Printed Circuit Board for LED electronic products
1.Specification:
| 1 | Layer | 1-30 layer |
| 2 | Material | FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum |
| 3 | Board thickness | 0.2mm-7mm |
| 4 | Max.finished board side | 500mm*500mm |
| 5 | Min.drilled hole size | 0.25mm |
| 6 | Min.line width | 0.075mm(3mil) |
| 7 | Min.line spaceing | 0.075mm(3mil) |
| 8 | Surface finish/treatment | HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating |
| 9 | Copper thickness | 0.5-4.0oz |
| 10 | Solder mask color | green/black/white/red/blue/yellow |
| 11 | Inner packing | Vacuum packing,Plastic bag |
| 12 | Outer packing | Standard carton packing |
| 13 | Hole tolerance | PTH:¡À0.076,NTPH:¡À0.05 |
| 14 | Certificate | UL,ISO9001,ISO14001,ROHS,CQC |
| 15 | Profiling Punching | Routing,V-CUT,Beveling |
| 16 | Assembly Service | Providing OEM service to all sorts of printed circuit board assembly |
2. Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.