Layer count  

1-28

Mine line width/space

4mil/4mil(100um/100um)

Thickness of inner copper

1/3oz,1/2oz,1oz,2oz,3oz

Thickness of finished panel

0.2-4.0mm

Tolerance of finished panel thickness

Thickness< 0.5mm     ±0.05

Thickness≥0.6-1.0mm ±10%

Thickness>1.2mm     ±0.127

Min diameter of finished hole

0.20mm

Min drilling diameter

0.20mm

Thickness of solder mask

Line end           0.4-1.2mil

Line comer         ≥0.2mil

Hardness of solder mask

6H

Min solder mask dam

4.0mil(100um)

Max solder mask plug hole diameter

0.6mm

V-cut angle

25°,30°,45°,60°

Range of bevel ange

25°-60°

Warp and twist

≤0.5%

Surface treatment

HAL/HAL lead free,gold finger,OSP,silver,gold

Type of ccl material

FR-4,AL,CEM-1,CEM-3,TG 180